【5304】ＳＥＣカーボン【ＳＥＣ】
1 : 管理人 : 2012/07/30(月) 20:36:33 ID:OwnerKabu685
ＳＥＣカーボン［5304］ - 炭素製品、特に電炉向け人造黒鉛電極の大手メーカー。アルミニウム製錬用炭素製品、特殊炭素製品などが競争力強く、世界シェアは５割近くを有す。前身は１９３４年設立の昭和電極だが、生産開始直後の経営不振で、後の大谷重工業社長の大谷米太郎に経営を委ねた経緯から、今も大谷一族色が強い。アルミ製錬用中心に、輸出比率が６割前後に達している。付加価値の高いＩＴ・電子関連、自動車関連向け特殊炭素製品の用途開発に注力中。
会社HP：ttp://sec-carbon.com/
現在書き込みはありません。
ＳＥＣカーボンを保有している方や思惑のある方は、ぜひ書き込みして行ってください！
ＳＥＣカーボンの銘柄情報はコチラ→5304
［5304］ＳＥＣカーボン 2ch&Yahoo板統合 新着口コミ情報
※コメントは常に更新されます
【速報】急騰・急落銘柄報告スレ18284 より
687 :山師さん＠トレード中 ：2025/04/29(火)21:59:48 ID:mf0eOL3f0NIKU
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん：2025/04/21(月)22:53:54 ID:fbXSdLse
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
547 :山師さん：2025/04/21(月)23:01:35 Rfp0DKa2
>>536
荒らすなボケ！
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん：2025/04/21(月)22:51:37 ID:HQwTJw7C
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん：2025/04/21(月)22:51:14 ID:N5bUdpKO
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん：2025/04/21(月)22:51:03 ID:+p5wlGn+
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん：2025/04/21(月)22:50:11 ID:rwHZuuRz
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【速報】急騰・急落銘柄報告スレ18266 より
171 :山師さん＠トレード中 ：2025/04/21(月)13:30:54 ID:stPpNvOs0
5304で損切ったアドバンを5334で再度300買い
すぐやられるだろ
【急騰】今買えばいい株22201【ウジクロ】 より
986 :山師さん：2025/04/19(土)01:00:31 ID:UkmbMZAr
これに反応したんか？
取引量少ないから値が飛びそう
🔴 WH National Security Adviser Waltz and US Secretary of State Rubio favor strikes on Iran's nuclear capabilities - Washington Post.
🔴ホワイトハウスのウォルツ国家安全保障担当大統領補佐官と米国のルビオ国務長官はイランの核能力への攻撃を支持 - ワシントンポスト。
990 :：2025/04/19(土)01:31:57 iN5nKQnP
>>986
やっぱマンデーかよ
Yahoo掲示板（Y板） - 5304より
911 :手作り感のあるホーム…：2025/04/17(木)09:53:00 ID:yuk*****
手作り感のあるホームページ地味に好きだったんだが、外注して作らせたようなデザインに変更されてる
【急騰】今買えばいい株22192【黙曜日】 より
408 :山師さん：2025/04/17(木)08:46:02 ID:tUrG77Gq
「Secure multi-party computation」とか「秘匿マルチパーティ計算」とか「秘密 MPC」とかぐぐってみろ
秘密計算の企業なんて腐るほどある
【急騰】今買えばいい株22192【黙曜日】 より
317 :山師さん：2025/04/17(木)08:29:20 ID:tUrG77Gq
ZenmuTechのオンリーワン煽りはハメコミだぞ
秘密計算の企業なんてちょっとググるだけでこんなにあるからな
秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html
主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC
秘密計算に取り組む企業まとめ（MPC編）
https://acompany.tech/privacytechlab/companies-work-on-multi-party-computation
海外企業： inpher、Partisia、 Sepior、 TNO、 Unbound Tech
国内企業： Acompany、NEC、 NTT
【 AI解析×秘密計算のEAGLYS】Microsoft for Startupsに採択 | EAGLYS 株式会社のプレスリリース
323 :山師さん：2025/04/17(木)08:31:22 SJ2/zIzN
>>317
ネクストウェアと提携してるだろ？
【急騰】今買えばいい株22191【Doする？手土産】 より
287 :山師さん：2025/04/16(水)21:48:23 ID:i93nKzV1
【速報】 米国、中国に245％の関税 中国以外の国の高関税は一時停止 ★3
https://asahi.5ch.net/test/read.cgi/newsplus/1744805008/1
1: お断り ★ 2025/04/16(水) 21:03:28.69 ID:8nf12XOb9
Today, President Donald J. Trump signed an Executive Order launching an investigation into the national security risks posed by U.S. reliance on imported processed critical minerals and their derivative products.
本日、トランプ大統領は米国が加工された重要鉱物とその派生製品の輸入に依存していることがもたらす国家安全保障上のリスクについて調査開始する大統領令に署名を行った。
As a result, the individualized higher tariffs are currently paused amid these discussions, except for China, which retaliated.
報復措置を取った中国を除き、個別の高関税の導入は協議が続く中で現在一時停止している。
China now faces up to a 245% tariff on imports to the United States as a result of its retaliatory actions.
中国は報復措置の結果、米国への輸入品に最大245％の関税を課す。
ホワイトハウス公式 (現地時間)2025/4/15 ソース英語『Fact Sheet: President Donald J. Trump Ensures National Security and Economic Resilience Through Section 232 Actions on Processed Critical Minerals and Derivative Products』
https://www.whitehouse.gov/fact-sheets/2025/04/fact-sheet-president-donald-j-trump-ensures-national-security-and-economic-resilience-through-section-232-actions-on-processed-critical-minerals-and-derivative-products/
Yahoo掲示板（Y板） - 5304より
910 :ここ弱いねんな：2025/04/16(水)18:29:00 ID:e99*****
ここ弱いねんな
Yahoo掲示板（Y板） - 5304より
909 :今は自社株買いのチャ…：2025/04/16(水)08:42:00 ID:わっしょい
今は自社株買いのチャンス
【急騰】今買えばいい株22184【ケツ舐め】 より
545 :山師さん：2025/04/16(水)06:23:14 ID:13LbGcyG
ZenmuTechのオンリーワン煽りはハメコミだぞ
秘密計算の企業なんてちょっとググるだけでこんなにあるからな
騙されるなよ
秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html
主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC
秘密計算に取り組む企業まとめ（MPC編）
https://acompany.tech/privacytechlab/companies-work-on-multi-party-computation
海外企業： inpher、Partisia、 Sepior、 TNO、 Unbound Tech
国内企業： Acompany、NEC、 NTT
【 AI解析×秘密計算のEAGLYS】Microsoft for Startupsに採択 | EAGLYS 株式会社のプレスリリース
【速報】急騰・急落銘柄報告スレ18248 より
76 :山師さん＠トレード中 ：2025/04/13(日)21:28:43 ID:gx1pQhaP0
Forget tariffs — Beijing is already choking off US exports on the sly
China juices trade war with nontariff barriers targeting MAGA-friendly U.S. export sectors.（POLITICO）
関税は忘れよ - 北京はすでに密かに米国の輸出を締め出している
中国はMAGAに友好的な米国の輸出部門を標的にした非関税障壁で貿易戦争を仕掛けている。
そう言う事でしたか・・・(´・ω・`)
Yahoo掲示板（Y板） - 5304より
908 :EUで炭素廃止された…：2025/04/13(日)14:48:00 ID:wee*****
EUで炭素廃止されたらせくかぼに響きますかね？代替の鋼材株の方が いいって事あり得ますか？
【急騰】今買えばいい株22173【安息の休日】 より
334 :山師さん：2025/04/12(土)22:19:54 ID:iobT34dq
ZenmuTechのオンリーワン煽りはハメコミだぞ
秘密計算の企業なんてちょっとググるだけでこんなにあるからな
騙されるなよ
秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html
主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC
秘密計算に取り組む企業まとめ（MPC編）
https://acompany.tech/privacytechlab/companies-work-on-multi-party-computation
海外企業： inpher、Partisia、 Sepior、 TNO、 Unbound Tech
国内企業： Acompany、NEC、 NTT
【 AI解析×秘密計算のEAGLYS】Microsoft for Startupsに採択 | EAGLYS 株式会社のプレスリリース
【急騰】今買えばいい株22173【安息の休日】 より
141 :山師さん：2025/04/12(土)19:28:46 ID:vShyQXNs
トランプ氏にインサイダー取引疑惑 民主党議員団、SECに調査要請 [香味焙煎★]
159 :山師さん：2025/04/12(土)19:52:34 qbZzfjJe
>>141
やばー
Yahoo掲示板（Y板） - 5304より
907 :EUで車の炭素繊維が…：2025/04/12(土)10:40:00 ID:yrh
EUで車の炭素繊維が禁止になれば、 今以上にアルミの使用が増えるのでは。
【急騰】今買えばいい株22164【鼻金】 より
496 :山師さん：2025/04/11(金)07:54:46 ID:mj/VLIy9
ZenmuTechのオンリーワン煽りはハメコミだぞ
秘密計算の企業なんてちょっとググるだけでこんなにあるからな
秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html
主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC
秘密計算に取り組む企業まとめ（MPC編）
https://acompany.tech/privacytechlab/companies-work-on-multi-party-computation
海外企業： inpher、Partisia、 Sepior、 TNO、 Unbound Tech
国内企業： Acompany、NEC、 NTT
【 AI解析×秘密計算のEAGLYS】Microsoft for Startupsに採択 | EAGLYS 株式会社のプレスリリース
【急騰】今買えばいい株22164【鼻金】 より
277 :山師さん：2025/04/11(金)06:27:50 ID:mj/VLIy9
秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html
主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC
【急騰】今買えばいい株22163【米中摩擦】 より
465 :山師さん：2025/04/10(木)19:08:50 ID:miMMg26A
主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC
秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html
Yahoo掲示板（Y板） - 5304より
906 :だから言ったでしょ。…：2025/04/10(木)09:11:00 ID:dou*****
だから言ったでしょ。思いっきり買っていて正解。
Yahoo掲示板（Y板） - 5304より
905 :これがあるからなぁ …：2025/04/10(木)05:33:00 ID:てんでんこ
これがあるからなぁ トラちゃん('ω')
Yahoo掲示板（Y板） - 5304より
904 :関税交渉で為替が大き…：2025/04/09(水)08:59:00 ID:Agnostic
関税交渉で為替が大きく浮上し、やや不安。ただ過去の2024/3期予想は125円前提で経常利益70億円だったので、為替だけの問題ならこの辺りで踏みとどまると期待したい。東海カーボンの生産設備集約や対中関税で黒鉛電極は上向くだろうし。財務は全く不安ないので、我慢して付き合っていれば、いつか良い日がくると思ってホールドか。ここで円安メリット銘柄ヘシフトとかバタバタ動くのが良いとは思えません。
続きは5304銘柄情報ページでご確認ください
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週刊SPA！7／24・31合併号のマネー(得)総本部のコーナーで当サイト『恐るべき注目銘柄株速報』のインタビュー記事が掲載されました。
White House Press Sec Leavitt: Amazon Announcement Was Hostile
ホワイトハウスのリービット報道官：アマゾンの発表は敵対的だった
なんか知らんけど米国内でケンカだケンカだー(´・ω・｀)