6273ＳＭＣ(株)
市場：東証PRM
業種：機械業
SMC Corpは、主に自動制御機器事業の製造と販売に従事する日本に拠点を置く企業です。同社は、自動制御機器の製造と販売に従事しています。これは、工場自動化（FA）のための不可欠な元素機器です。主な製品には、方向制御機器、駆動装置、空気圧補助装置、温度制御機器とセンサーが含まれます。この機器は、鉄鋼産業、化学産業、食品製造業、物理学、化学、医療機器産業などに使用されています。
関連： FA/機械・部品/JPX日経400/アベノミクス/タッチパネル/ロボット/中国/中東/設備投資/シャリア指数/Society5.0/TOPIXコア30/サービスロボット/JPXプライム150/読売333
スポンサード リンク
スポンサード リンク
- 全て表示
- 関連ブログ情報
- 【2ch】市況１/株式板（5ch）
- 【Yahoo】ファイナンス掲示板
- twitter呟き
- ［6273］ＳＭＣ 株式掲示板
関連ブログ情報 新着リスト
-
-
2025/04/30 PR
ＳＭＣ(6273)を今から買って大丈夫か？不安要素はいくつかあります…。
- 株式投資の世界で勝ち続けるためには、「銘柄の選定」と「銘柄の売買タイミング」が大事です。適当な銘柄選定では勝てませんし、売買タイミングを誤ってしまうと…
- https://exiv.ne.jp/
-
-
-
2024/12/11
株式 - 今の注目銘柄 ⇒ 4393バンクイノベ 6273SMC 他（12月10日14～15時）ランキング
- 今の注目銘柄 ⇒ 4393バンクイノベ 6273SMC 他（12月10日14～15時）ランキング - 【仕手株】恐るべき注目銘柄株速報
- https://antena2chfinance.blog.jp/archives/1084011543.html
-
-
-
2024/11/22
ハーモニック・ドライブ・システムズ株価格付け「HOLD」目標株価4427円→2629円
- ドイツ証券レーティングSMC(6273)「HOLD」継続 目標株価74758円→69543円ハーモニック・ドライブ・システムズ(632)「HOLD」継続 目標株価4427円→2629円
- https://jpxnikkei400.net/deutschebank/harmonic-drive-systems-3
-
-
-
2024/07/08
上がりそうな株 7月9日の株式予想
- ZOZO 3092三菱電機 6503SMC 6273ネクソン 3659...
- http://shisutemu.blog45.fc2.com/blog-entry-4675.html
-
【2ch】市況1板、株式板の反応（新着順）
スポンサード リンク
【速報】急騰・急落銘柄報告スレ18284 より
921 :：2025/04/30(水)06:16:11 ID:9XjPNKmfM.net
【速報】急騰・急落銘柄報告スレ18284 より
905 :山師さん＠トレード中 ：2025/04/30(水)05:44:16 ID:+wQbSHzf0.net
Super Micro Computer Inc
SMCI:NASDAQ
After Hours: Last | 4:38 PM EDT
29.94 quote price arrow down-6.06 (-16.83%)
Super Micro shares dive after server maker issues weak preliminary financials（CNBC）
スーパーマイクロ株、サーバーメーカーが低調な仮決算発表で急落
一応置いておきます(´・ω・`)
【急騰】今買えばいい株22233【黄金週間】 より
403 :山師さん：2025/04/28(月)09:44:06 ID:q4fAGPPY.net
半導体はファーウェイのAI向けGPU ＆ TSMCの下半期成長率で悪い材料２つ出ているのがな
【急騰】今買えばいい株22233【黄金週間】 より
341 :山師さん：2025/04/28(月)09:36:22 ID:q4fAGPPY.net
半導体はTSMCの下半期成長率が5.7％まで落ち込むってのがな
過去5年と比較するとピークすぎたような
https://pgw.udn.com.tw/gw/photo.php?u=https://uc.udn.com.tw/photo/2025/04/28/2/31938629.jpg
【急騰】今買えばいい株22209【リクスー女の尻を】 より
586 :：2025/04/22(火)09:17:07 ID:2ReCh6wU.net
アメリカ→TSMC業績絶好調でも寄り天大暴落
日本→アメリカ暴落してもぶち上げｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗ
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん：2025/04/21(月)22:53:54 ID:fbXSdLse.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん：2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん：2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん：2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん：2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
151 :山師さん：2025/04/21(月)18:53:46 ID:S19z8uDF.net
https://x.com/TrendForceJP/status/1914220057057702379?t=PQ7u66x8bVIdcn4n_Y3XrA&s=19
TSMCは動きが早いな
そしてついに半導体パッケージ技術はFOPLP全盛期に向かうことになりそうだね
【急騰】今買えばいい株22204【日本株暴騰】 より
258 :山師さん：2025/04/21(月)07:54:16 ID:KBiEUTXX.net
TSMC
インテル提携を否定
今週の大手テック決算はほぼ終わりました
【急騰】今買えばいい株22202【踏み逃げカスしね】 より
660 :山師さん：2025/04/19(土)17:57:08 ID:sKq4Z36z.net
半導体「前工程」の技術革新は限界だが、「後工程」は進化の余地…設備投資加速「ＴＳＭＣ進出はチャンス」
2025/04/18 15:38
半導体の組み立てや検査といった「 後あと 工程」と呼ばれる分野の企業が、設備投資を積極的に進めている。「 前まえ 工程」で世界を代表する台湾積体電路製造（ＴＳＭＣ）の熊本進出などで商機が広がっているためだ。技術革新に向けて連携する動きもある。
【速報】急騰・急落銘柄報告スレ18263 より
509 :山師さん＠トレード中 ：2025/04/19(土)05:25:41 ID:UPZnZ9/60.net
日本が関税ヘイブンみたいな国になってもおもしろそうだなー
そのときは九州がブツの玄関になったりしてな
中国韓国近くて熊本にTSMCもあるし
(´・ω・`)と思うワイであった
【急騰】今買えばいい株22199【週末どこ行こ】 より
109 :山師さん：2025/04/18(金)10:46:58 ID:f/qaO3di.net
TSMC全然盛り上がらん
台湾が始まったらディスコ売りが増えた
853.00 TWD +6.00 (0.71%)
板別にレスを表示する
Yahoo掲示板（Y板）の反応（新着順）
スポンサード リンク
2025/04/30(水) 21:08:00投稿者:uas*****
頼む！もう一回下で買わせてください！
2025/04/30(水) 15:57:00投稿者:pol*****
今日もホールド
午前、下がったら買い増しと思ってチラチラ見てたけど、そこまで行かなかった
2025/04/30(水) 14:37:00投稿者:yuk*****
にんにん、11840で年初来高値更新。
今年12000見たような気がするけど、予知能力が
目覚めたのかな。監視。
2025/04/30(水) 14:13:00投稿者:黒豆大福
TVにはヤフ板に貼っている程度の公開分析を連日アップしてますよ。
流石に勝負用のフルレバ分析は非公開ですが
2025/04/30(水) 13:34:00投稿者:明日も山田
53000付近まで一気もありそうだし、49000から44500あたりまで助走つけそうな気もするし
ただ、利確は正義と考えると48900で、一旦利確しておこうかな…
値が嵩むので、入り直しが容易ではないから悩む
2025/04/30(水) 12:54:00投稿者:Aaa
ほらほらぁーまた上がってきちゃったー
買えないよーん
2025/04/30(水) 10:48:00投稿者:stm
重要指標控えてますからね
2025/04/30(水) 10:35:00投稿者:kum*****
あっちもこっちも出来高ス力スカ。
な～む～♪
2025/04/30(水) 10:00:00投稿者:Aaa
やべー買いたいよーー
ルール通り40000割まで待ってからとか言っておきながらそこまで落ちてこなさそう
2025/04/30(水) 09:45:00投稿者:プー子だよ
stm様、
貴重な情報ありがとうございます
twitter検索
|
graphman100
【🇯🇵時価総額上位銘柄トレンド③】
8766 東京海上ホールディングス
8031 三井物産
7741 HOYA
3382 セブン＆アイ・ホールディングス
2914 JT
6981 村田製作所
6594 日本電産
7751 キヤノン… https://t.co/86Jm2UnH0p |
|---|
|
butayalaw
このあたりも上がると出ている（数理統計）…
6367 ダイキン工業
8035 東京エレクトロン
4051 ＧＭＯ－ＦＧ
6861 キーエンス
6273 ＳＭＣ
7309 シマノ
3697 ＳＨＩＦＴ |
|---|
|
miyiwex798
6273 ＳＭＣ
来週ストップ高買い気配、
7月31日現在の株主を対象に1→3の株式分割を実施。
https://t.co/qVMoVzIoNE |
|---|
|
NozomiMorii
４日前場の日経平均株価は前日比３０６円５５銭安の３万３４４６円７８銭と大幅反落。
伊藤忠 <8001> 、三井物 <8031> 、三菱商 <8058> などの卸売株も安い。
コマツ <6301> 、日立建機 <6305> 、Ｓ… https://t.co/Vx621L44XP |
|---|
|
kabudev_gc
5246 ELEMENTS
2329 東北新社
7222 日産車体
6762 TDK
6459 大和冷機工業
6035 アイ・アールジャパンHD
6754 アンリツ
4386 SIGグループ
4080 田中化学研究所
6332 月… https://t.co/nuGKeW5Ajy |
|---|
週刊SPA！7／24・31合併号のマネー(得)総本部のコーナーで当サイト『恐るべき注目銘柄株速報』のインタビュー記事が掲載されました。
キターーー
Investing.com — エヌビディア（NASDAQ:NVDA）株は火曜日の時間外取引で1.7%下落した。これは主要顧客であるSuper Micro Computer Inc（NASDAQ:SMCI）が予想を大幅に下回る第3四半期の予備的業績を発表したことを受けたものである。Super Microはエヌビディアのチップを搭載した先進的AIサーバーを製造している。