【208】構造計画研究所ホールディングス【構造計】
1 : 管理人 : 2024/06/20(木) 17:50:02 ID:OwnerKabu685
構造計画研究所ホールディングス［208］ - 構造計画,構造計,構造研,ＫＫＥ,構造計画研究所
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［208］構造計画研究所ホールディングス 2ch&Yahoo板統合 新着口コミ情報
※コメントは常に更新されます
【急騰】今買えばいい株22241【石破減配祭り】 より
902 :山師さん：2025/04/30(水)14:46:39 ID:nx1NONJH
【速報】急騰・急落銘柄報告スレ18285 より
202 :山師さん＠トレード中 ：2025/04/30(水)09:10:41 ID:a0a1ZT9j0
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18282 より
205 :山師さん＠トレード中 ：2025/04/28(月)14:17:55 ID:dpg8KI2y0
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
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35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18278 より
388 :山師さん＠トレード中 ：2025/04/26(土)00:48:54 ID:s+c8u4o10
JAPAN WEIGHS IMPORTING MORE US CORN IN TARIFF NEGOTIATIONS - NIKKEI
日本、関税交渉で米国産トウモロコシの輸入拡大を検討 - 日本経済新聞
大豆とトウモロコシで許してもらえるんやろか(´・ω・｀)
【速報】急騰・急落銘柄報告スレ18276 より
481 :山師さん＠トレード中：2025/04/25(金)10:19:16 ID:xxDgiy4+0
ラジオＮＩＫＫＥＩでたこ焼きのCM来たｗ
【速報】急騰・急落銘柄報告スレ18275 より
795 :山師さん＠トレード中 ：2025/04/25(金)00:46:55 ID:ctQhwxTA0
JAPAN IS CONSIDERING INCREASE IN IMPORTS OF AMERICAN SOYBEANS TO HELP U.S. OFFSET LOSS OF EXPORTS TO CHINA - NIKKEI
日本、米国産大豆の輸入増を検討 中国への輸出減を補う - 日本経済新聞
納豆増産待ったなし(´・ω・｀)
857 :山師さん＠トレード中 ：2025/04/25(金)05:45:16 JoI5HJ/t0
>>795
あべちゃんのコーンのときとかわってない(´･ω･｀)
799 :山師さん＠トレード中 ：2025/04/25(金)01:03:45 y7LKI0SZ0
>>795
米がないなら納豆を食えばいいじゃない(´・ω・｀)ナットウキナーゼトワネット
【急騰】今買えばいい株22223【火の車】 より
884 :：2025/04/24(木)13:18:54 ID:GEMjA0Yt
ナスダック暴騰でもマイテンしそうなNIKKEIｗｗｗｗｗｗｗ
【速報】急騰・急落銘柄報告スレ18274 より
354 :山師さん＠トレード中 ：2025/04/24(木)12:47:22 ID:IkTancqJ0
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22220【関税撤廃思惑】 より
524 :山師さん：2025/04/24(木)05:56:27 ID:hj/ngPeu
ベッセント米財務長官、日本に「通貨目標求めず」ps://www.nikkei.com/article/DGXZQOCB23AKH0T20C25A4000000/
プラザ合意やらんとよ
620 :：2025/04/24(木)07:12:08 2GGTYUsu
>>524
なんだ、120円やめるんかよ
なら追加関税撤回の条件どうなるんだ
無条件？
537 :山師さん：2025/04/24(木)06:20:50 tQbM8D5m
>>524
失われた30年の増税円高デフレ、緊縮財政で供給力を潰してきた。労働者も米も減反減反減反。人不足、米不足。氷河期は精神崩壊。円安で生産拠点を日本に戻してもまともに働ける人はいない。
1990年リベラル
「円高で外国産や中国産がお得に買える。日本産や日本人雇用は廃止で！日本産や日本人雇用、日本産子供は全て外国産に置き換えよう！」
1970年→1ドル360円
1985年→1ドル260円→プラザ合意
1986年→1ドル150円
2011年→3.11民主党、原発爆発させて1ドル76円
2012年→復興増税で1ドル75円
アニメーターやメディア関連、マスコミ、映像関係、SEやプログラマー、IT技術者、半導体、NHKなどは30年の円高で中国、韓国に投げて、日本人は滅びている。社会保険料増税の薬剤製造もワクチンもほぼ外国製。
Yahoo掲示板（Y板） - 208より
326 :連売り連買いばかりで…：2025/04/23(水)17:36:00 ID:NIN
連売り連買いばかりでボラ大きいなあ…
【急騰】今買えばいい株22210【全無】 より
947 :山師さん：2025/04/22(火)12:15:23 ID:/WxXsUim
補償対応を指示」証券口座乗っ取り受け 加藤金融相
//www.nikkei.com/article/DGXZQOUB221T10S5A420C2000000/
証券会社大損w
減益必至か？w
969 :山師さん：2025/04/22(火)12:19:45 TayubWhE
>>947
SBIとか速攻で規約変更して補填しないようにしてなかったっけ？
966 :：2025/04/22(火)12:19:10 2ReCh6wU
>>947
これ大型株や国債うって財源作るはめになるならヤバくね？
959 :山師さん：2025/04/22(火)12:17:30 JbIyq+lr
>>947
こんなん証券会社の手数料爆上げ不可避やん
956 :山師さん：2025/04/22(火)12:17:01 MrGN+YJT
>>947
自民党大丈夫か
954 :山師さん：2025/04/22(火)12:16:36 sw1Ydlql
>>947
とっとと捕まえて回収しろよｗ
953 :山師さん：2025/04/22(火)12:16:33 6d+tR6eu
>>947
うをおおおおおおおおおおおおおおおおおおおおおおおおおおおおおお
【急騰】今買えばいい株22213【修正】 より
20 :山師さん：2025/04/22(火)10:03:33 ID:qYz2zeDq
低位株さようなら
東証、名ばかり｢グロース｣に新基準 時価総額100億円未満は廃止
s://www.nikkei.com/article/DGXZQOUB17B0V0X10C25A4000000/
25 :山師さん：2025/04/22(火)10:05:16 mbvuopkC
>>20
JDI先生は大丈夫そうで良かった
【速報】急騰・急落銘柄報告スレ18268 より
263 :山師さん＠トレード中 ：2025/04/22(火)09:48:08 ID:Rr435rSC0
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
★決済の日時とPRICEは非公表です
Yahoo掲示板（Y板） - 208より
325 :寄り付き気配弱いけど…：2025/04/22(火)08:56:00 ID:72e*****
寄り付き気配弱いけどなんかあった？ 買っていいやつ？
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん：2025/04/21(月)22:53:54 ID:fbXSdLse
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
547 :山師さん：2025/04/21(月)23:01:35 Rfp0DKa2
>>536
荒らすなボケ！
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん：2025/04/21(月)22:51:37 ID:HQwTJw7C
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん：2025/04/21(月)22:51:14 ID:N5bUdpKO
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん：2025/04/21(月)22:51:03 ID:+p5wlGn+
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん：2025/04/21(月)22:50:11 ID:rwHZuuRz
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【速報】急騰・急落銘柄報告スレ18265 より
157 :山師さん＠トレード中 ：2025/04/21(月)09:15:52 ID:Yh09BF960
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
★決済の日時とPRICEは非公表です
Yahoo掲示板（Y板） - 208より
324 :地震銘柄。：2025/04/20(日)07:03:00 ID:関西同盟
地震銘柄。明日も上がるやろね。
【急騰】今買えばいい株22200【パヒューム】 より
712 :山師さん：2025/04/18(金)14:40:25 ID:3H7xwlKs
もらいまくりだ！s://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO6285218018042025000000-1.jpg?ixlib=js-3.8.0&w=1276&h=852&auto=format%2Ccompress&fit=crop&bg=FFFFFF&s=1d71ff501bc4c6ea82c088c55e2f380b
923 :：2025/04/18(金)15:10:42 Y+4M1pGq
>>712
made in China
804 :山師さん：2025/04/18(金)14:52:44 fDRcofLd
>>712
赤澤きゃわ
728 :山師さん：2025/04/18(金)14:42:33 /1rWyiyJ
>>712
日本もMAGAの一員だ！うおおおおおおおおお
723 :山師さん：2025/04/18(金)14:41:38 EfWxKfqL
>>712
もう赤沢総理でいいだろ
容姿もいいし品もあるし東大法学部卒で留学経験あって英語話せるし
719 :山師さん：2025/04/18(金)14:41:27 Ds8ldPaw
>>712
日本からはメタプラの帽子でユニフォーム好感や
【急騰】今買えばいい株22200【パヒューム】 より
497 :山師さん：2025/04/18(金)14:12:11 ID:0FPbChnx
NIKKEIが空を飛ぶ〜♪
【速報】急騰・急落銘柄報告スレ18261 より
355 :山師さん＠トレード中 ：2025/04/18(金)09:25:39 ID:348JL1m30
Nikkei 225 Index YEN-Based Futures：BUY
6月限
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★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22197【コロコロ恫喝】 より
703 :山師さん：2025/04/18(金)07:18:14 ID:YzZwUuu8
日米財務相会合、22日で調整 円安是正へ為替など議論か
//www.nikkei.com/article/DGXZQOGN17EJR0X10C25A4000000/
789 :山師さん：2025/04/18(金)07:55:58 6d1oGGQA
>>703
いつもならアク抜け〜だが円高固定なら日経下がるかもな
ひとまず中国が協議するから株高トレンドは継続だろうけど
754 :山師さん：2025/04/18(金)07:44:39 5EP1qtCx
>>703
はいインチキ爆上げ確定👍
【急騰】今買えばいい株22197【コロコロ恫喝】 より
663 :山師さん：2025/04/18(金)06:36:51 ID:e3x4YII6
日米財務相会合、22日で調整 円安是正へ為替など議論か
//www.nikkei.com/article/DGXZQOGN17EJR0X10C25A4000000/
ぎょえええええw
130台きゅっどw
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Nathan @Nathan9983
14:45:50
証券口座乗っ取り、三菱UFJモルガンも確認 大手で9社目 - 日本経済新聞 nikkei.com/article/DGXZQO…