楽天マンはnot good bye(´・ω・`)

旭川の看護師は中古のデミオでも良いじゃないかと言ってるが？
むしろ魚になる前の稚魚を擁護してるというか所有を信じてた優しいやつだしな

> 160 山師さん sage 2023/11/19(日) 21:29:07.27 ID:I7yehIvj
> てかその妙なあだ名誰が拡げたんだよ
> 沙羅ちゃんのジャンプ失格から１～２回しか職種業種言ったことねえぞ(´・ω・｀)
> でもデミオバカにするやつは大概チリンチリンだから気にするな


>>59は伝説の800レス爺さんだから相手にしちゃだめだ

Nikkei 225 Index YEN-Based Futures：BUY
6月限
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円

★決済の日時とPRICEは非公表です

Nikkei 225 Index YEN-Based Futures：BUY
6月限
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円

★決済の日時とPRICEは非公表です

YEデジタルとか今のうちに集めといたら2倍はとれるかな？

Trump: Focus will be on people making less than $200k a year.
トランプ年収20万ドル以下の人々に焦点を当てる。

日本ならほとんど全員ｗ(´・ω・｀)

Five Years After He Escaped in a Crate, Fugitive Carlos Ghosn Is Teaching Business Strategy
We visited Ghosn in Lebanon where he’s avoiding arrest warrants from Japan and France
（ウォールストリートジャーナル）
木箱で逃亡してから5年、逃亡中のカルロス・ゴーンはビジネス戦略を教えている
我々は、日本とフランスからの逮捕状を逃れているレバノンのゴーンを訪ねた

優雅な逃亡生活　(´・ω・`)

とりあえずyeデジタル買ってみるか

Nikkei 225 Index YEN-Based Futures：BUY
6月限
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円

★決済の日時とPRICEは非公表です

688：山師さん：[sage]：2025/04/23(水) 19:37:11.99 ID:W/UVm5/o
この話蒸し返したくはなかったけど、以前キラスラに20万貸したものだけど普通に踏み倒されたわw
名前教えてもらったし、端金だしどうこうするつもりもないけど貸すやつは踏み倒されるつもりで金貸せよw

712：山師さん：[sage]：2025/04/23(水) 19:41:31.72 ID:W/UVm5/o

俺が融資したのなかったことにされててわらったw
忘れたとは言わせない
ギャンブルカスの脳内ってどうなってんだ

735：山師さん：[sage]：2025/04/23(水) 19:45:22.82 ID:W/UVm5/o

お前よくそんな態度で出られるな
いい加減にしろ

748：山師さん：[sage]：2025/04/23(水) 19:47:41.42 ID:W/UVm5/o

2年半くらい前なのに忘れたの
北綾瀬のガストって言えば思い出すかな

820：千早愛音 ◆i6DiHTaREeOr ：2025/04/23(水) 20:08:12.92 ID:el7yeoUj
20万とか言ってたやつは結局嘘かな？

20万とかしょっぼいくせにネチネチ言ってくるのリアルだったわ
3桁貸す人って何も言わんからね

840：千早愛音 ◆i6DiHTaREeOr ：2025/04/23(水) 20:11:03.42 ID:7VGosihS
いや20万でネチネチ言うなよってなw
ちょっと背伸びしてたんかなーって思うからw
背伸びするくらいなら借金してもっと背伸びしろよってな

かっけえぇぇぇぇww

Nikkei 225 Index YEN-Based Futures：BUY
6月限
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円

★決済の日時とPRICEは非公表です

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

YEN大人気ｗｗｗ

Nikkei 225 Index YEN-Based Futures：BUY
6月限
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円

★決済の日時とPRICEは非公表です

Nikkei 225 Index YEN-Based Futures：BUY
6月限
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円

★決済の日時とPRICEは非公表です

FinancialJuice
@financialjuice
China March survey-based jobless rate for 16-24 years old, excluding college students
at 16.5% vs 16.9% in previous month - Stats Bureau.
中国3月の調査に基づく16～24歳の失業率（大学生を除く）は16.5％で、
前月の16.9％から低下した - 国家統計局。

低下したとしても、公表数字でこの数字だと、日本の就職氷河期の頃より悪いのね　(´・ω・`)