毎日毎日コロ助もそろそろどうだ？

ジャミル・ラフマーン🍛🕌
@Jamil_1000PRI
·
3月11日
なんかもう疲れちった

ｗｗ


まゆ@株 @mayu_19760623
39s
この人どんな意図でこんなこと書いてるんだろうね？
読んだ人びびっただろうけどこの人暴騰した銘柄を解説してるだけだからねー
そんなこと私にでもできるよー x.com/muratamika2021…

ウルフ村田（ 村田美夏 ） @muratamika2021
メモ　ネクストウェア（4814）が過去に仕手株とみなされた経緯と、今回の急騰が短期で終わる可能性について、以下の観点から分析します。
1. 過去の仕手株としての経緯

>>21
ps://x.com/ZanEngineer/status/1915780899050045587?t=MRrEo2mibOXj3RAmiu0mMQ&s=19
しかも氷河期世代から評価を削って給料を捻出
さすがにネタだろと思いたい

夢を見てる奴らに送るぜDreamin’(´・ω・｀)

アドバンスト安に刺しとくか

ｗｗ


与沢 翼 - YOZAWA TSUBASA
@tsubasa_yozawa
私が死ぬと YOZAWA ASAMI 100％の割合で2,000万ドル（約28.5億円）が支払われる生命保険に入っています。死亡理由は、自殺、他殺、事故、病死問いません。何でも支払いがされます。グレートイースタンというシンガポールの保険会社です。バンクオブシンガポールの小島さんに紹介され、2018年10月に加入しました。IPGホーデンのヴィザ寛子さんが担当してくれています。ヴィザさんはとてもよくしてくれています。既に解約申請しましたが、解約完了の連絡がまだ来ていません。もしタイの刑務所に連れて行かれた場合、中で殺される可能性もゼロではないです。もし、証拠捏造された場合、ドラッグのセラーという冤罪となれば、死刑宣告される可能性もゼロとは言い切れません。ドラッグのセラーなどしていませんが、すべての可能性を今は排除できません。被害妄想と一蹴されそうですが、この生命保険の存在は事実です。日本大使館へ亡命することを検討し始めました。そのうえ日本へ帰国します。自首したいです。その場合、タイから日本へ引き渡していただけると幸いです。そして、恐喝の被害届を提出することに決めました。ご迷惑をおかけしてすみません。本当に申し訳ありません。

与沢 翼 - YOZAWA TSUBASA
@tsubasa_yozawa
私が死ぬと YOZAWA ASAMI 100％の割合で2,000万ドル（約28.5億円）が支払われる生命保険に入っています。死亡理由は、自殺、他殺、事故、病死問いません。何でも支払いがされます。グレートイースタンというシンガポールの保険会社です。バンクオブシンガポールの小島さんに紹介され、2018年10月に加入しました。IPGホーデンのヴィザ寛子さんが担当してくれています。ヴィザさんはとてもよくしてくれています。既に解約申請しましたが、解約完了の連絡がまだ来ていません。もしタイの刑務所に連れて行かれた場合、中で殺される可能性もゼロではないです。もし、証拠捏造された場合、ドラッグのセラーという冤罪となれば、死刑宣告される可能性もゼロとは言い切れません。ドラッグのセラーなどしていませんが、すべての可能性を今は排除できません。被害妄想と一蹴されそうですが、この生命保険の存在は事実です。日本大使館へ亡命することを検討し始めました。そのうえ日本へ帰国します。自首したいです。その場合、タイから日本へ引き渡していただけると幸いです。そして、恐喝の被害届を提出することに決めました。ご迷惑をおかけしてすみません。本当に申し訳ありません。

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

MAMIKO　SHOHEI OHTANI 2世
で決まり（´・ω・｀）

中国の建設会社が早くて安い理由(´・ω・`)
x.com/masami777777/status/1912800776852029809?t=CjszvcuMAlrQBG3z2BWhmQ&s=19

【速報】 米国、中国に245％の関税　中国以外の国の高関税は一時停止 ★3
https://asahi.5ch.net/test/read.cgi/newsplus/1744805008/1
1: お断り ★ 2025/04/16(水) 21:03:28.69 ID:8nf12XOb9
Today, President Donald J. Trump signed an Executive Order launching an investigation into the national security risks posed by U.S. reliance on imported processed critical minerals and their derivative products.
本日、トランプ大統領は米国が加工された重要鉱物とその派生製品の輸入に依存していることがもたらす国家安全保障上のリスクについて調査開始する大統領令に署名を行った。

As a result, the individualized higher tariffs are currently paused amid these discussions, except for China, which retaliated.
報復措置を取った中国を除き、個別の高関税の導入は協議が続く中で現在一時停止している。

China now faces up to a 245% tariff on imports to the United States as a result of its retaliatory actions.
中国は報復措置の結果、米国への輸入品に最大245％の関税を課す。

ホワイトハウス公式 (現地時間)2025/4/15 ソース英語『Fact Sheet: President Donald J. Trump Ensures National Security and Economic Resilience Through Section 232 Actions on Processed Critical Minerals and Derivative Products』
https://www.whitehouse.gov/fact-sheets/2025/04/fact-sheet-president-donald-j-trump-ensures-national-security-and-economic-resilience-through-section-232-actions-on-processed-critical-minerals-and-derivative-products/

EU's Trade Chief Sefcovic left the meeting with little clarity on the US stance,
struggling to determine the American side’s aims, according to people familiar
with the talks. He met for about two hours with US Commerce Secretary
Lutnick and USTR Greer in Washington Monday.

欧州連合（EU）のセフコビ○チ通商部長は、アメリカ側の狙いを見極めるのに苦慮し、
アメリカ側の姿勢をほとんど明確にしないまま会談を終えた。
月曜日にワシントンでルトニック米商務長官、グリア米通商代表部（USTR）と約2時間会談した。

EU破談かもしれないってよ(´・ω・｀)

>>686
Zero-day options are fueling the unprecedented volatility on Wall Street amid tariff chaos（CNBC）
ゼロデイ・オプションが、関税の混乱の中、ウォール街の空前のボラティリティに拍車をかけている

記事内
「The trading volume of 0DTE options tied to the S&P 500 surged to 8.5 million in April, a 23% jump since
the beginning of the year and accounting for roughly 7% of the total volume in U.S. option markets,
according to data from JPMorgan.」
JPモルガンのデータによると、S&P500に連動する0DTEオプションの4月の取引量は850万枚に急増し、
年初から23%急増し、米国オプション市場全体の取引量の約7%を占めた。

働くより、ギャンブルで一儲けや！　・・・なんて(´・ω・`)

OPEC cuts oil demand forecast this year and next amid trade war.
OPEC、貿易戦争の中、今年と来年の石油需要見通しを下方修正。

あんまり下がってない(´・ω・｀)

Chinese airline Juneyao delays delivery of a Boeing 787 jet amid the US/China tariff dispute.
中国航空会社ジュンヤオ、米中関税紛争でボーイング787型機の納入を延期。

そうなりますわなあ(´・ω・｀)

アメリカにはYAMAGAMIはいないのかな(´･ω･`)