Super Micro Computer Inc
SMCI:NASDAQ
After Hours: Last | 4:38 PM EDT
29.94 quote price arrow down-6.06 (-16.83%)

Super Micro shares dive after server maker issues weak preliminary financials（CNBC）
スーパーマイクロ株、サーバーメーカーが低調な仮決算発表で急落

一応置いておきます(´・ω・`)

FinancialJuice
@financialjuice
Japan Economy Minister Akazawa: We are not thinking about sacrificing agricultural
products for the sake of autos in tariff negotiations
赤沢経財相：関税交渉において、自動車を理由に農産物を犠牲にすることは考えていない
参考
自民・食料安保本部「農水産品を犠牲にするな」決議を採択　森山幹事長「守るべきは守るという姿勢を徹底」
4/25(金)（TBS NEWS DIG Powered by JNN）

アメリカは、そんなに日本に都合良く話を受けてくれるのだろうか？　(´・ω・`)

US TOLD LAST WEEK JAPAN IT CAN'T GET SPECIAL TREATMENT - NHK

終

OFFICIAL TRUMP
13.059 +4.186 (+47.18%)

トランプコイン　(´・ω・`)

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

トランプ大統領の経済政策支持率、関税・インフレ反発で最低に – CNBC調査（Investing.com)
元ネタ(´・ω・`)
Trump’s approval rating on the economy drops to lowest of his presidential career, CNBC Survey finds（CNBC）
トランプ大統領の経済政策に対する評価低下、大統領就任以来最低に CNBC調査結果

FinancialJuice
@financialjuice
Ukraine imposes sanctions on several Chinese entities - Zelenskiy's Decree

ウクライナが複数の中国企業に制裁を発動 - ゼレンスキー大統領令

US Treasury Secretary Bessent has cautioned White House officials on attempts to fire fed's Powell -Politico.
ベッセント米財務長官、パウエル財務長官を解任しようとするホワイトハウス高官に警告 - Politico.

この唯一正常な人がやめたら面白くなりそうなんだけど(´・ω・｀)

FinancialJuice
@financialjuice
Trump: The Fed should have lowered interest rates long ago.
トランプ FRBはもっと前に金利を引き下げるべきだった。

FinancialJuice
@financialjuice
Trump: Powell’s termination cannot come fast enough.
トランプ パウエルの解任はすぐにはできない。

FinancialJuice
@financialjuice
Trump: Jerome Powell is always too late and wrong.
トランプ ジェローム・パウエルはいつも遅すぎるし、間違っている。

まーた批判が始まった　(´・ω・`)

FinancialJuice
@financialjuice
China March survey-based jobless rate for 16-24 years old, excluding college students
at 16.5% vs 16.9% in previous month - Stats Bureau.
中国3月の調査に基づく16～24歳の失業率（大学生を除く）は16.5％で、
前月の16.9％から低下した - 国家統計局。

低下したとしても、公表数字でこの数字だと、日本の就職氷河期の頃より悪いのね　(´・ω・`)

>>443
FinancialJuice
@financialjuice
Trump: Japan is coming in today to negotiate tariffs & the cost of military support

トランプ氏：日本は今日、関税と軍事支援の費用について交渉するために来訪する

一応追加　(´・ω・`)

人口超知能（Artificial Super Intelligence、ASI）とは
人間の知能を超えた能力を持つ人工知能（AI）を指します

FinancialJuice
@financialjuice
🔴 WH Press Sec. Leavitt: Relief is being considered for farmers.
リービット大統領報道官：農民の救済を検討中。

今後の日米間の交渉で、農産物関係で色々出て来そう　(´・ω・`)

FinancialJuice
@financialjuice
Trump: to provide detail on semiconductor tariffs Monday
トランプ大統領：月曜日に半導体関税の詳細を発表へ

まーた変な事言わなければ良いけど　(´・ω・`)

Warning lights flash for US consumer strength as credit defaults rise （THE FINANCIAL TIMES）
クレジット・デフォルトの増加で米消費者の強さに警告灯が点滅

ヒタヒタと、目立たずに近づいて来るものが・・・(´・ω・`)

FinancialJuice
@financialjuice
WH Press Sec. Leavitt: Treasury Secretary is keeping a very close eye on the bond market.
ホワイトハウス報道官レビット氏：財務長官は債券市場を非常に注意深く監視しています。

中国に手の内を見せた様な感じ　(´・ω・`)