万博　　＼(^o^)／ｵﾜﾀ


https://x.com/ito072495234909/status/1913935199689457975

ｗ

https://x.com/miiitan_n/status/1913947508494999797

次
【速報】急騰・急落銘柄報告スレ18269
https://hayabusa9.5ch.net/test/read.cgi/livemarket1/1745293410/

コメ「安ければ海外から買うのか」　江藤農水相、輸入拡大に疑問 [夜のけいちゃん★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745289989/

https://jp.reuters.com/world/us/2L52WAESZBJXVHBDP27FHHZSRE-2025-04-22/
「米教育省、学生ローン延滞者から回収再開　5月から
2025年4月22日午前 9:42 」

【群馬】生活保護利用者を「あいつらはくず」　相談窓口の闇、桐生市役所内からの証言も ★3 [nita★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745273435/

ハーバード大学　トランプ政権を提訴 [蚤の市★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745275313/

LNG輸入拡大、本格検討 対米黒字削減、関税交渉カードに [蚤の市★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745275704/

モナカチョコジャンボ(´・ω・｀)
https://x.com/aru19rina/status/1914272054641410465?t=-ewTCDjfM79NdVlR0rnqrQ&s=19

【速報】急騰・急落銘柄報告スレ18268
https://hayabusa9.5ch.net/test/read.cgi/livemarket1/1745280082/

次(´・ω・｀)

GW初日のホテル、客室単価16%上昇　予約の4割近くが訪日客 [蚤の市★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745275126/

日本旅行に注意、「ウイルスのるつぼ」と化している「よく考えてから行くべき」―台湾メディア [4/21] [昆虫図鑑★]
ps://lavender.5ch.net/test/read.cgi/news4plus/1745219272/

本日のメニュー
坪田
アマノ
USS

日野自と三菱ふそうが統合へ　トヨタ･ダイムラーとトラック世界連合 [蚤の市★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745273205/

ダウ平均一時1300ドル超下落　トランプ大統領のFRB議長解任への懸念で大幅続落 [香味焙煎★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745268797/

ダウ平均一時1300ドル超下落　トランプ大統領のFRB議長解任への懸念で大幅続落 [香味焙煎★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745268797/

ダウ、マイナス１０００ドル！ドル円１３０台目前！マンデー到来間近 [219241683]
https://greta.5ch.net/test/read.cgi/poverty/1745251108/

中国BYD、日本で軽自動車のEVを発売へ [123322212]
https://hayabusa9.5ch.net/test/read.cgi/news/1745244952/

DHL to suspend global shipments of over $800 to US consumers（ロイター）
DHL、米国消費者への800ドル以上のグローバル発送を停止へ

一応置いておきます(´・ω・`)

パカライト今の基準じゃ作れないのはわかってるんだけどなんだか・・
tps://youtu.be/dzSzYgsD0Ig?si=lUsMuFat6JqXa14d

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

米卸大手、大儲け！！売上100億増、純利益が18億から28億に爆上げ！ [754019341]
https://hayabusa9.5ch.net/test/read.cgi/news/1745232449/

https://x.com/TrendForceJP/status/1914220057057702379?t=PQ7u66x8bVIdcn4n_Y3XrA&s=19

TSMCは動きが早いな
そしてついに半導体パッケージ技術はFOPLP全盛期に向かうことになりそうだね

カバー超絶w
https://x.com/Holoearth_JP/status/1914242717825319326

ローマ教皇うわああああああああああああああああああああああああああ
https://jp.reuters.com/world/us/L3GL7HNHDJOB7K5FALFVKRTS3I-2025-04-20/

ローマ教皇死去 ★2 [どどん★]
https://asahi.5ch.net/test/read.cgi/newsplus/1745226049/

>>966
ローマ教皇はアニヲタっぽかった
https://blog-imgs-171.fc2.com/k/a/i/kaigainohannoublog/20241029125111422.png

https://x.com/arukime01/status/1415413743471665152/photo/1